热界面材料对高功率LED热阻的影响  

Influence of thermal interface material on high power LED thermal resistance

作　　者：殷录桥[1] 张金龙[1] 宋朋[1] 翁菲[1] 张建华[1] 

机构地区：[1]上海大学机电工程与自动化学院新型显示技术及应用集成教育部重点实验室,上海200072

出　　处：《光电子．激光》2013年第10期1862-1867,共6页Journal of Optoelectronics·Laser

基　　金：国家"十二五"科技支撑计划(2011BAE01B14);国家"973"重点基础研究(2011CB013103);上海高校青年教师培养资助计划;上学科技创新基金(sdcx2012024);上海市科委高压直流LED(11DZ1140402)资助项目

摘　　要：散热不良是制约大功率LED发展的主要瓶颈之一,直接影响着大高功率LED器件的寿命、出光效率和可靠性等。本文采用T3ster热阻测试仪和ANSYS热学模拟的方法对LED器件进行热学分析,以三种热界面材料(金锡,锡膏,银胶)对LED热阻及芯片结温的影响为例,分析了热界面材料的热导率、厚度对LED器件热学性能的影响,实验结果表明界面热阻在LED器件总热阻中所占比重较大,是影响LED结温高低的主要因素之一;热学模拟结果表明,界面材料的热导率、厚度及界面材料的有效接触率均会影响到LED器件结温的变化,所以在LED器件界面互连的设计中,需要综合考虑以上三个关键参数的控制,以实现散热性能最佳化。Heat dissipation is one of the bottlenecks which affect the life time,luminous efficiency and re- liability of LED devices. This is also the reason reson restrict the development of high power LED de- vices. Thermal analysis was carried out by combining T3ster thermal resistance tester with ANSYS sim- ulation. The thermal resistance and junction temperature performances of the three kinds of thermal in- terface materials （80Au20Sn, solder paste and silver paste） of HP-LED are compared first,then the in- terface material thermal conductivity,the interface material thickness and the contact ratio between the interface material with the chip are simulated respectively. The results show that the rinterface thermal resistance plays an important role on the total thermal resistance of LED devices, and is one of the main factors which affect the junction temperature of LED. The simulated results show that the interface ma- terial thermal conductivity, the interface material thickness and the contact ratio of the interface material all can influence of the HP-LED junction temperature. So these three parameters should be made an o- verall consideration for HP-LED thermal design.

关 键 词：高功率LED(HP—LED) 热分析 界面热阻 有限元分析 

分 类 号：TN364.2[电子电信—物理电子学]