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作 者:崔颖[1] 蔡安富[1] 陈新辉[1] 黄亦工[1]
出 处:《真空电子技术》2013年第4期88-91,共4页Vacuum Electronics
摘 要:本文采用两种不同的Mo粉处理工艺,将Mo粉中团聚体打开,获得粒度较小的Mo粉体,然后,找出适合处理后的Mo粉丝网印刷工艺。结果发现,Mo粉通过湿磨工艺处理后,D50可以降至1.78μm。用该种粉体金属化后的95%Al2O3陶瓷,其金属化层致密、均匀,封接强度较干磨工艺处理Mo获得的金属化封接强度提高了2.5倍,达到350MPa以上。95% Al2O3 ceramic were metallized with two kind of paste made of different molybdenum and other materials,which molybdenum powders were milled in a mill with or without ethano before mixing into paints.It was found that Molybdenum powders milled with ethano were finer than that without ethano,the mean particle size was decreased to 1.78 μm since the mill broke down agglomerates.Results showed that,when 95% Al2O3 ceramic were metallized with paste made of fine molybdenum powders milled with ethano,its metallizing layers was dense andits sealing strength,which reached at above 350 MPa,was 2.5 times larger than that of 95% Al2O3ceramic metallized with paste made of molybdenum powders milled without ethano.
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