微焊点纳米压痕循环力学行为与承受载荷的关联性  

Effect of maximum loading on cycling mechanics behavior of micro-soldered joints by nanoindentation method

作　　者：王丽凤[1] 吕烨[1] 戴洪斌[1] 张璞乐 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040

出　　处：《焊接学报》2013年第10期75-78,117,共4页Transactions of The China Welding Institution

基　　金：黑龙江省教育厅2012年度科学面上资助项目(12521068)

摘　　要：通过对Sn-3.0Ag-0.5Cu/Cu和Sn-0.3Ag-0.7Cu/Cu微焊点进行循环加载—卸载方式的纳米压痕试验,研究了焊点循环力学行为与承受最大载荷的关联性.结果表明,循环F-h曲线在闭合前表现为1个迟滞回环,随着最大载荷的增加,焊点迟滞回环的面积和残余压痕深度增大;当最大载荷一定时,迟滞回环的面积及残余压痕深度增量随着加载次数的增加逐渐减小;微焊点的压痕蠕变C随最大载荷的增大而不断降低,同时随加载次数的增加先急剧减小而后逐渐趋于平稳.Sn-3.0Ag-0.5Cu/Cu焊点的压痕蠕变低于Sn-0.3Ag-0.7Cu/Cu焊点的蠕变量.Through the cyclic load-unload test of nano-indentation method,the effects of maximum load on cycling mechanics behavior for two kinds micro-solder joints of Sn-3. 0Ag-0. 5Cu / Cu and Sn-0. 3Ag-0. 7Cu / Cu were investigated. The results indicated that the cycling F-h curves that before closed showed a hysteresis loop. The area of hysteresis loop and indentation residual depth of micro-soldered joints increased with the increase of the maximum load. The cumulative damage of microsoldered joints increased. When the maximum load was given,the area of hysteresis loop and increments of residual indentation depth decreased gradually with the loading time increasing. Indentation creep C of micro-soldered joints decreased with the increase of the maximum load. At the same time,indentation creep C of micro-soldered joints sharply decreased at first and then plateaued with the loading time increasing. Indentation creep C of Sn-3. 0Ag-0. 5Cu / Cu micro-soldered joint was less than that of Sn-0. 3Ag-0. 7Cu / Cu micro-soldered joint.

关 键 词：纳米压入法 微焊点 循环加载卸载 蠕变 

分 类 号：TG425.1[金属学及工艺—焊接]