等温时效对SnX5.0Cu1.5Ni/Cu界面层组织的影响  

Effect of isothermal aging on microstructure at the interface between SnX5.0Cu1.5Ni solder and Cu substrate

作　　者：李伟[1] 陈海燕[1] 揭晓华[1] 张海燕[1] 郭黎 

机构地区：[1]广东工业大学材料与能源学院,广东广州510006 [2]高新锡业有限公司,广东惠州516123

出　　处：《材料热处理学报》2013年第10期170-175,共6页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(No.20971027);广东省部产学研结合项目(2010B090400207);广东省大学生创新创业训练项目(1184512190)

摘　　要：基于Cu和Sn元素在焊接界面扩散结构(Cu/Cu3Sn/Cu6Sn5/Sn)中的扩散通量比理论模型,将SnX5.0Cu1.5Ni焊点在180℃进行等温时效,研究SnX5.0Cu1.5Ni焊点中金属间化合物(Intermetallic Compound,IMC)的Cu3Sn与Cu6Sn5两相组织形貌演变和生长行为。结果表明:SnX5.0Cu1.5Ni界面金属间化合物的Cu3Sn与Cu6Sn5两相增厚主要由扩散机制控制,Cu3Sn相生长速率为4.16×10-18m2/s,Cu6Sn5生长速率为1.06×10-17m2/s。在时效初期,IMC的形态呈扇贝形状,此时Cu3Sn快速生长,并消耗Cu6Sn5层,因此Cu6Sn5在时效初始阶段厚度降低,Cu3Sn厚度升高;随着时效时间的延长,IMC的形态向着平层形状转变,Cu3Sn的生长速率降低,对Cu6Sn5层的消耗也逐步减少;随着时效时间的进一步延长,Cu3Sn和Cu6Sn5的厚度继续增大,使得金属化合物在应力过大而破裂。Based on the ratio of Cu to Sn diffusion fluxes at the Cu/Cu3 Sn/Cu6 SnJSn interface, the microstrueture evolution and the behavior of the formation and growth of intermetallic compound （IMC） layer at the interface between Sn-5OX-1.5Cu-Ni solder and Cu substrate after isothermal aging at 180 ℃ were studied. The results show that the thickness of IMC layers increases with the increasing of the aging time, and their growth is mainly controlled by diffusion mechanism. Intermetallic growth rate constant for Cu3 Sn and Cu6Sn5 is 4. 16 × 10^-18 m2/s and 2. 51 × 10 -17 mE/s, respectively. According to the growth model, the CuaSn grows fast at the cost of Cu6Sn5 layer at the early stage. With the aging process the growth rate of Cu3Sn slows down, as well as the consumption rate of the Cu6Sn5 layer. The morphology of the IMC changes from scalloped shape to planar shape. Finally, the Cu3 Sn and Cu6Sn5 layer thickness increases similarly.

关 键 词：等温时效 无铅焊料 金属间化合物 生长速率 

分 类 号：TG166.7[金属学及工艺—热处理]