毫米波射频互连微组装工艺优化研究  

Process Optimization for Technology of Micro Assembly in Millimeter Wave RF Interconnection

作　　者：任榕[1] 卢绍英[1] 赵丹[1] 解启林[1] 邱颖霞[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2013年第10期1-4,9,共5页Electronics & Packaging

基　　金：国防基础科研项目(A1120110020)

摘　　要：在毫米波产品的装配中,射频互连微组装工艺是影响产品性能的一个重要因素。采用三维电磁仿真软件对毫米波频段的组装缝隙宽度、金丝热超声楔焊跨距及拱高进行了建模仿真,分析了上述因素对驻波的影响。针对模拟仿真优化结果,给出了毫米波射频互连装配精度控制、接地焊接效果优化、金丝热超声楔焊线型及键合参数优化等相应的工艺优化措施,从而达到毫米波射频互连微组装工艺优化的目的。Micro assembly of RF interconnection is the key means in the assembly of millimeter wave products. The three-dimensional electromagnetic simulation software was used to simulate analysis of millimeter wave RF interconnection models. The impacts of assembly slit width and gold wire thermo-sonic wedge bonding on the voltage standing wave ratio were analyzed. Based on the simulation results, optimum processes such as assembly precision control, grounding connection effect, bond-wire loop parameter and bond parameter optimization were provided. And then the optimum performance was obtained for micro assembly of millimeter wave RF interconnection process.

关 键 词：毫米波射频互连 微组装工艺优化 装配精度 接地效果 金丝热超声楔焊 

分 类 号：TN305.94[电子电信—物理电子学]