IC引线焊接用超声键合换能器的优化控制  

An Optimized Control System of Ultrasonic Bonding Transducer

作　　者：卢玲 范音 

机构地区：[1]杭州优博信息科技有限公司,浙江杭州310012 [2]杭州科布伦茨电气有限公司,浙江杭州310052

出　　处：《杭州电子科技大学学报（自然科学版）》2013年第5期187-190,共4页Journal of Hangzhou Dianzi University：Natural Sciences

摘　　要：大规模集成电路芯片内晶片与IC引脚间的引线焊接常用基于超声键合压电换能器的超声波焊接工艺,因此超声键合换能器的控制性能直接影响了引线焊接质量及IC芯片的可靠性。该文在分析压电换能器特性的基础上,提出了一种对压电换能器特性参数进行自动辨识的扫频自学习方法,及基于调节器参数自整定的换能器优化控制方法,并介绍了以高性能DSP为核心的压电换能器控制系统的技术实现方案,该系统已在国际品牌的IC封装设备金线焊线机中得到应用。Ultrasonic welding process based on piezoelectric transducer is commonly used in wire bonding between the wafer pads and lead pads of the LSI chips, therefore, the control performance of the ultrasonic bonding transducer directly affects the welding quality and the reliability of the IC chips. This paper analyzes the characteristics of piezoelectric transducer, and presents an automatic identification method of the piezoelectric ultrasonic transducer parameters based on frequency sweep and self-learning for the bonding system. The paper also proposes an optimal control scheme with a self-turning controller for the transducer, and introduces the control system approach of the ultrasonic bonding transducer based on a high-performance DSP chip as the core. The system has been applied in international brands＇ gold wire bonder products.

关 键 词：超声键合换能器 超声波焊接 参数辨识 优化控制 

分 类 号：TP29[自动化与计算机技术—检测技术与自动化装置]