Sn-4Cu过共晶无铅钎料的液态性能  

Properties of Hypereutectic Sn-4Cu Lead-free Solder in Melting State

作　　者：曹明明[1] 杜长华[1] 甘贵生[1] 唐明[1] 王青萌 罗虎[1] 

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400054

出　　处：《重庆理工大学学报（自然科学）》2013年第10期25-28,共4页Journal of Chongqing University of Technology：Natural Science

基　　金：重庆高校优秀成果转化资助重大项目(KJZH11215)

摘　　要：在大气气氛下,采用撇取表面膜、润湿平衡和铺展性试验的方法,研究了Sn-4Cu液态钎料的抗氧化性、润湿性和漫流性等工艺性能。研究结果表明:在恒温条件下,液态钎料表面氧化产渣量随撇渣频率的加快而增加,其氧化渣的生成随时间的变化服从抛物线规律;在变温条件下,升高温度可以明显加快氧化,但能显著改善钎料对母材的润湿性和铺展性;在350℃条件下,采用DMA-1钎剂,钎料在铜表面的润湿时间t0=0.29 s,润湿力F max=3.81 mN,扩展率可达80%。The processing properties of the liquid Sn-4Cu lead-free solder were studied under atmosphere condition.The results show that the oxidizing slag quantity on liquid solder surface increases with the frequency of scraping off the residue and the relation of oxidation residue with the change of time accord with the parabola rule at the same temperature.Temperature rise obviously accelerates the oxidation; however,it can significantly improve wettability and spreadability of the liquid solder.At 350℃,when using DMA-lflux for the solder on copper,wetting time to is 0.29 s,Fmax is 3.81 mN,and spreading rate is up to 80％.

关 键 词：Sn-4Cu合金 无铅钎料 液态性能 

分 类 号：TG425.1[金属学及工艺—焊接]