图形电路化学镍金镀层品质缺陷与分析  

Analysis the Quality Defect of Electroless Nickel gold Plating Coating for Patterned Circuits

作　　者：刘东光[1] 胡江华[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《中国电子科学研究院学报》2013年第5期470-473,共4页Journal of China Academy of Electronics and Information Technology

基　　金：国防基础科研项目(A1120110020)

摘　　要：采用无氰化学镍金工艺在3种精细图形电路表面化学镀镍金,针对工艺在实验过程中出现的镀层品质缺陷失效进行原因分析,探讨图形电路本身特征引起的漏镀,渗镀,镀层出现针孔,粗糙等品质缺陷原因,采用各种显微分析手段深入了解引发这些品质缺陷的原因,找到合理的工艺解决方案,得出了在生产过程中镀层品质失效的原因和后续的制作工艺改善建议,对于精细图形电路表面处理具有十分重要意义。Electroless nickel gold plating technology is used to deposit nickel gold film on three kind of patterned circuits. The quality defect failures of nickel gold coating are analyzed, some opinions about the problems which occur during the production process of chemical immersion Ni/Au are proposed. The rea- sons of leaking and bleeding in immersion Ni/Au process are detected, by using scanning electron micro- scope （SEM） and OM surface profiler. Other defects, including leaking, bleeding, pinhole, chemical micro-etching impacting are analyzed by microcosmic structure, roughness of coating surface, corrective actions and preventive measures, and farther investigation and the relative effective solutions are presen- ted. This technology is significant to the fine-pitch patterned circuits.

关 键 词：图形电路 漏镀 渗镀 表面 

分 类 号：TN205.1[电子电信—物理电子学]