含硅水性环氧固化剂的制备与性能  

Preparation and Properties of Silicon-Containing Waterborne Epoxy Curing Agents

作　　者：周继亮[1] 程新建[1] 张道洪[1] 张爱清[1] 

机构地区：[1]催化材料科学湖北省暨国家民委-教育部共建重点实验室中南民族大学,湖北武汉430074

出　　处：《高分子材料科学与工程》2013年第11期149-154,共6页Polymer Materials Science & Engineering

基　　金：中南民族大学中央高校基金(ZZQ10002)

摘　　要：以三乙烯四胺（TETA）、酚醛环氧树脂（F-51）、含硅单环氧化合物（JH-0187）、辛基缩水甘油醚（OGE）等为原料合成新型含硅水性环氧固化剂来改善水性环氧树脂涂膜的综合性能。探讨了反应温度、反应时间对环氧基转化率的影响,以及固化剂中含硅量对涂膜性能的影响。研究结果表明,控制TETA与OGE/JH-0187的反应温度为75℃,反应6.5h可合成出TETA-OGE/JH-0187加成物,然后与F-51在75℃加成反应6.5h合成出F-51-TETA-OGE/JH-0187加成物;再降温到60℃滴加冰醋酸成盐,减压蒸馏去除溶剂后,加入蒸馏水配置成固含量45%左右的新型水性含硅环氧固化剂;封端反应过程中选择含硅单环氧化合物（JH-0187）占封端所用总单环氧化合物的5%～7.5%时,所合成的含硅水性环氧固化剂所制涂膜综合性能最优异,具有良好的物理力学性能和耐化学品性能。In order to improve the film property of waterborne epoxy resin coating, a silicon-containing waterborne epoxy curing agent was prepared using triethylene tetramine （TETA）, phenolic epoxy resin （F-51）, octyl glycidyl ether（OGE） and monoepoxy-based silicon-containing compound（JH-0187） as raw materials. Firstly, TETA-OGE/JH-0187 was synthesised using OGE/JH-0187 as sealing reagents of TETA in propylene glycol methyl ether（PM）under the condition of reaction temperature（65 ℃） and reaction time（6.5h）. Secondly, phenolic epoxy resin （F-51） reacted dropwise with TETA-OGE/JH-0187 to synthesize F-51-TETA-OGE/JH-0187. In order to improve the water dispersibility of F-51-TETA-OGE/JH-0187, acetic acid was used with the salting degree of 20%. Finally, after PM was removed by distillation, water was added into F-51-TETA-OGE/JH-0187 until solids content became 45%. The effects of reaction temperature, reaction time on the epoxy conversion were discussed. And also the effects of silicon content of the curing agent on the prepared film property were discussed. The results indicate that the two-component film with prepared waterborne epoxy curing agent of 5%～7.5% and epoxy resin has good mechanical performances and anticorrosive performance.

关 键 词：固化剂 水性环氧树脂 涂膜 合成 

分 类 号：TQ630.49[化学工程—精细化工]