浅谈化学镀铜  

On Chemical Copper Plating

作　　者：李义田[1] 

机构地区：[1]渤海船舶职业学院,葫芦岛125000

出　　处：《价值工程》2013年第35期317-318,共2页Value Engineering

摘　　要：非导体材料的金属化处理经常会用到化学镀铜,化学镀铜无论是在塑料制品还是在电子工业的印制电路板中均得到了广泛的应用。本文主要介绍了化学镀铜溶液的组成及工艺条件,化学镀铜溶液中各组分的作用和影响,化学镀铜溶液的配制、使用和维护等。Metal processing of non conducting materials often uses chemical copper plating, which is widely used in plastic products and the printed circuit board of electronic industry. This paper mainly introduces the composition of chemical copper plating solution and process conditions, the role and influence of the components of chemical copper plating solution, plating solution preparation, and use and maintenance.

关 键 词：化学镀铜 溶液 组成 作用 

分 类 号：TQ153.14[化学工程—电化学工业]