小型无线通信机中的IC封装技术现状及展望  

Present Situation and Prospect of IC Packaging Technologies for Portable Wireless Communication Products

作　　者：赵钰[1] 

机构地区：[1]信息产业部电子第43研究所,合肥230022

出　　处：《电子元器件应用》2000年第12期3-6,共4页Electronic Component & Device Applications

摘　　要：本文首先介绍无线通信市场对IC封装技术的要求,然后详细介绍IC封装的现状和新型封装技术的实例。最后简述了未来IC封装的趋势及挑战。This paper first describes market requirements of portable wireless communication products for IC package, and then introduces in detail present situation of IC package and some examples with novel packaging technologies. At last it describes the trends and the challenges of IC packages.

关 键 词：无线通信机 IC封装 集成电路 

分 类 号：TN92[电子电信—通信与信息系统] TN405.94[电子电信—信息与通信工程]