RFID标签中ACA固化的动态DSC研究  

Dynamic DSC research of the anisotropic conductive adhesive in RFID tags

作　　者：范守元 陈建魁[1] 尹周平[1] 

机构地区：[1]华中科技大学数字制造装备与技术国家重点实验室,湖北武汉430074

出　　处：《电子元件与材料》2013年第12期59-63,共5页Electronic Components And Materials

基　　金：国家"973"课题资助项目(No.2009CB7242047);国家自然科学基金重点资助项目(No.2013010)

摘　　要：采用动态差示扫描量热仪(DSC)对RFID标签制造工艺中所用各向异性导电胶(ACA)的固化反应动力学进行了研究。分别通过常用的n级反应模型法和自催化模型法求解了固化反应动力学方程。结果表明,n级反应模型和自催化模型忽略了ACA固化反应的复杂性,计算曲线均与实验值存在较大偏差,不能很好地用于描述ACA的固化过程。采用非模型动力学计算该固化体系的反应活化能,结果表明反应活化能是固化度的函数,并不是一个定值。当较低的升温速率用于计算活化能曲线时,则在固化度高于80%时活化能有明显的增大。The study of curing reaction kinetics of the epoxy-based anisotropic conductive adhesive（ACA） in RFID tags process was carried out by dynamic DSC. The kinetic mechanism functions were determined using n orders reaction model and autocatalytic model respectively. The results show that there is great deviation between these two kinetics models and the experimental results, the models ignore the complexity of ACA curing reaction, that don＇t suit to describe curing process of ACA. The reaction activation energy of the system was calculated by using model free kinetics. Results show that the reaction activation energy is the function of the cure degree, which is not a fixed value. When reaction activation energy curve was calculated by using the lower rate of increasing temperature, the activation energy has significantly rising when the cure degree is above 80%.

关 键 词：各向异性导电胶 固化反应 n级动力学模型 自催化模型 非模型动力学 动态DSC 

分 类 号：TQ323.1[化学工程—合成树脂塑料工业]