3mm厚大口径超薄元件双面抛光工艺  

Double-side polishing of 3mm large-aperture ultra-thin component

作　　者：何曼泽[1] 王琳[1] 周佩璠[1] 马平[1] 鄢定尧[1] 

机构地区：[1]成都精密光学工程研究中心,成都610041

出　　处：《强激光与粒子束》2013年第12期3315-3317,共3页High Power Laser and Particle Beams

基　　金：国家高技术发展计划项目

摘　　要：基于环摆双面抛光技术,研究了3mm厚大口径超薄元件的双面抛光加工工艺。通过对双面抛光原理的分析,对转速比、抛光垫面形、抛光液等工艺参数上作了优化,并通过加工模拟进行验证。通过工件环分离器减薄技术解决了3mm厚超薄元件的装夹问题。在SYP152双面主动抛光机上进行了加工工艺实验,通过调节转速比实现3mm厚大口径超薄元件面形的高效收敛,验证了加工的可行性,并且达到了面形精度优于1.5λ(λ=632.8nm)、表面粗糙度优于1nm的技术水平。We studied the double side polishing process of large aperture ultra thin component based on the technology of ring polishing and pendulum. The technical optimization included the speed ratio control, polishing pad shape modification and polishing particle size convergenee. Computer simulation produced evidence in support of the optimization. The trouble of uhra~ thin component＇s damage in original separator was overcome by material replacement and separator thinning. We achieved the convergence of surface shape by adjusting the speed ratio on SYP152 double-side polishing machine. Through these experiments, we verified the feasibility of this processing method, the surface PV value could attain to less than 1.5λ（λ=632.8nm）, the surface roughness could be reduced to less than 1 nm.

关 键 词：双面抛光 大口径超薄元件 工艺优化 转速比 加工模拟 

分 类 号：TG356[金属学及工艺—金属压力加工]