低损耗ZrTi_2O_6填充PTFE复合基板性能  

Properties of low loss ZrTi_2O_6 filled PTFE composite substrates

作　　者：吴开拓[1] 袁颖[1] 张树人[1] 闫翔宇[1] 崔毓仁[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,电子薄膜与集成器件国家重点实验室,成都610054

出　　处：《复合材料学报》2013年第6期76-81,共6页Acta Materiae Compositae Sinica

基　　金：中央高校基本科研业务费专项资金(ZYGX2012J035)

摘　　要：采用热压成型工艺，制备了一种低损耗ZrTi2O6陶瓷填充聚四氟乙烯（PTFE）的新型微波复合基板材料。采用介质谐振器法研究了ZrTi2O6/PTFE复合材料的微波介电性能（8~12 GHz）。结果表明，ZrTi2O6/PTFE复合材料的相对介电常数（ε r）和介电损耗（tanδ）随着ZrTi2O6陶瓷体积分数（0~46%）的增加而增大，介电常数实验值与Lichtenecker模型预测值最吻合。ZrTi2O6/PTFE复合材料的热膨胀系数和介电常数温度系数随着ZrTi2O6陶瓷体积分数的增加而减小。46%的ZrTi2O6为较优填料比例，ZrTi2O6/PTFE的相对介电常数为7.42，介电损耗为0.0022（10 GHz）。A new kind of low loss ZrTi2O6 filled polytetrafluoroethylene （PTFE） microwave composite substrates were fabricated through the hot-pressing process. The microwave dielectric properties of the composites were measured using dielectric resonator method （18-12 GHz）. The relative permittivity （εr） and loss tangent （tanδ） of the composites increase with an increase of the volume fraction of ZrTi2O6 ceramic （0-46%）. The experimental dielectric constants of the composites match well with the theoretically predicted values using Lichtenecker model. As the volume fraction of ZrTi2O6 ceramic increases, the thermal expansion coefficient and the temperature coefficient of dielectric constant decrease. The ZrTi2O6/PTFE composites exhibit a dielectric constant of 7.42 with a loss tangent of 0.0022 （10 GHz） at an optimum filler volume fraction of 46% ZrTi2O6.

关 键 词：复合材料 ZrTi2O6 聚四氟乙烯 介电特性 基板 

分 类 号：TB332[一般工业技术—材料科学与工程]