有铅无铅高密度混装工艺技术研究  

Assembly Technology of High-density Board with Lead and Lead-free Materials

作　　者：张玮[1] 蒋庆磊[1] 严伟[1] 刘刚[1] 王旭艳[1] 

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子工艺技术》2013年第6期328-332,366,共6页Electronics Process Technology

基　　金：总装预研项目(项目编号115318150200)

摘　　要：随着电子产品无铅化的不断推进,在高可靠电子产品组装中,采用有铅焊料焊接有铅无铅镀层器件并存的情况不可避免。因此混合焊接工艺和焊点的可靠性是研究的重点。本文提出了有铅无铅高密度混装工艺研究方法,针对有铅无铅镀层兼容性、高密度混装再流焊工艺、及有铅无铅高密度混装焊点可靠性开展技术研究工作,并与同行业者分享阶段性研究成果。With the development of lead-free electronic process, the mix alloy soldering of lead and lead-free components with SnPb paste is inevitable in high reliability electronic assembly. Research emphasis is placed on soldering process and reliability of mixed solder. Present series experiences on assembly technology of high-density printed wiring board with lead and lead-free components. The investigation includes compatibility of lead-free fnishes with SnPb paste, refow soldering process of mixed assembly and reliability of mixed solders. The main experimental results are given.

关 键 词：有铅 无铅 有铅无铅混装 金属间化合物 可靠性 

分 类 号：TN605[电子电信—电路与系统]