纳米颗粒复合钎料搅拌辅助低温钎焊接头力学性能  

Mechanical Property for the Soldering Joints of Nano-Particle Composite Solder with Low-Temperature Stir Soldering

作　　者：甘贵生[1] 杜长华[1] 许惠斌[1] 杨滨[2] 李正康[1] 唐明[1] 曹明明[1] 

机构地区：[1]重庆理工大学,重庆400054 [2]北京科技大学新金属材料国家重点实验室,北京100083

出　　处：《稀有金属材料与工程》2013年第11期2416-2420,共5页Rare Metal Materials and Engineering

基　　金：重庆高校优秀成果转化资助重大项目(KJZH11215);国家自然科学基金(50975303);重庆理工大学科研启动基金(2012ZD12)

摘　　要：采用搅拌辅助低温(半固态区间)钎焊技术,成功制备了低银钎料和纳米复合钎料钎焊接头。研究表明,在低银钎料中加入纳米Ni颗粒,能提高钎料的润湿性和填缝能力,Ni与Cu6Sn5生成孔洞状的化合物(Cux Ni1-x)6Sn5及低温搅拌形成的微孔成为界面原子的扩散通道,使其界面IMC厚度都明显高于相同工艺下低银钎料钎焊接头。添加纳米颗粒后,钎料的抗拉强度较基体提高了15.7%,剪切强度较基体提高了22.9%,钎料及其接头由脆断向韧性断裂转变。在钎剂辅助基础上施加搅拌,其复合钎料接头抗拉强度和剪切强度分别较基体钎料的接头提高了32%和24%,相当甚至优于复合钎料本身的抗拉强度和剪切强度。The soldering joints of low silver solder and nano-particle composite solder were prepared by low-temperature soldering （at semi-solid state） with stirring.Researches have shown that the wettability and the filling ability of solders are improved by adding nano-Ni particles,the cavitary compounds of （CuxNi1-x） 6 Sn5 are generated by Ni with Cu6Sn5 and the micro voids formed by stirring at low temperature are the diffusion path of interface atoms,and the thickness of IMC increases compared with the soldering joints of low silver solder.The tensile strength and the shear strength is increased by 15.7% and 22.9%,respectively,and the low silver solder and its joints shift from the brittle broken to the ductile fracture after adding nano-particles.The tensile strength and the shear strength of the composites＇ soldering joints are increased by 32% and 24%,respectively,compared with the soldering joints of low silver solder using stirring and flux,which is amount to or even better than the tensile strength and the shear strength of nano-particle composite solder.

关 键 词：低温钎焊 纳米复合钎料 IMC 搅拌 力学性能 

分 类 号：TG425[金属学及工艺—焊接]