固结磨料研磨蓝宝石衬底的工艺研究  

Study on the Lapping Process of Sapphire Substrate through Fixed Abrasive

作　　者：李鹏鹏[1] 李军 王建彬[1] 夏磊[1] 朱永伟[1] 左敦稳[1] 

机构地区：[1]南京航空航天大学机电学院江苏省精密与微细制造技术重点实验室,南京210016

出　　处：《人工晶体学报》2013年第11期2258-2264,共7页Journal of Synthetic Crystals

基　　金：国家自然科学基金(51175260,50905086);中央高校基本科研业务专项资金(NP2012506,NS2013055);江苏省高校优势学科建设工程助项目

摘　　要：为获得高材料去除率和优表面质量的蓝宝石衬底,采用固结磨料研磨蓝宝石衬底提高加工效率,研究研磨压强、工作台转速、三乙醇胺(TEA)浓度和研磨垫类型四个因素对材料去除率和表面粗糙度的影响,并综合优化获得高材料去除率和优表面质量的工艺参数。结果表明:有图案的研磨垫、研磨压强为100 kPa、工作台转速为120 r/min、三乙醇胺的浓度为5%为最优研磨工艺参数组合,固结磨料研磨蓝宝石的材料去除率为31.1μm/min,表面粗糙度为0.309μm。In order to obtain the sapphire substrate with high material removal rate and good surface quality, fixed abrasive lapping technology was adopted to improve the processing efficiency. The effect of workbench speed, lapping pressure, the concentration of triethanolamine and abrasive pad types on material removal rate and surface roughness were investigated. The optimized process parameters for the high material removal rate and good surface quality were obtained. The results showed that the optimal parameters are the patterned lapping pad, lapping pressure 100 kPa, workbench speed 120 r/min and the concentration of triethanolamine 5%. The material removal rate can reach 31.1μm/min and the surface roughness is 0. 309 μm.

关 键 词：固结磨料 研磨 蓝宝石衬底 材料去除率 表面粗糙度 

分 类 号：TH161[机械工程—机械制造及自动化] TG741[金属学及工艺—刀具与模具]