逆向热键合技术制作SU-8胶纳流控通道  

Fabrication of SU-8 Nanofluidic Channels by Reverse Thermal Bonding under Mild Conditions

作　　者：涂吕星[1] 王旭迪[1] 葛良进 金建[1] 付绍军[2] 

机构地区：[1]合肥工业大学,合肥230009 [2]中国科技大学,合肥230000

出　　处：《真空科学与技术学报》2013年第12期1270-1275,共6页Chinese Journal of Vacuum Science and Technology

摘　　要：热键合技术常用于制备纳米通道,但其需要高温高压的工艺条件,因此难以获得大面积和尺寸可控的纳米通道。本文提出一种利用热键合技术制作尺寸可控的SU-8胶纳米通道的方法,该方法利用UV胶带在紫外曝光前后粘附力变化的特点,通过模板浇注获得SU-8胶的图形结构层,并将其转移到UV胶带上,其柔性保证了图形结构层与Si基底上封装胶层的大面积紧密贴合,然后键合完成纳米通道制作。本文分析了界面间粘附能的大小对图形转移和键合过程的影响,并通过改变封装胶层的厚度,获得了不同尺寸的纳米通道,建立起胶层厚度和纳米通道尺寸精确的线性关系。利用有限元模拟SU-8胶填充形成通道的机理,分析了毛细力在键合填充过程中的作用。A novel technique was developed to fabricate SU-8 nano-channels with controllable feature size by reverse thermal bonding under fairly mild conditions. The SU8 patterns were first fabricated by pouring photo-resist on the tem- plate,and then transferred to the uhraviolet （UV） tape, whose flexibility ensured that a large area of the patterned layer and the encapsulation layer of the Si substrate were laminated and well bonded, because UV irradiation is capable of com- pletely removing the interracial adhesion of the UV tape. The impacts of the interracial adhesion on pattern transfer and bonding were evaluated. The nano-channels with different sizes were fabricated by accurately adjusting the thickness of the encapsulation layer. The fabrication mechanism was simulated in finite element method, and the influence of the capillary force on the bonding was also tentatively discussed.

关 键 词：逆向热键合 SU-8 UV胶带纳米通道 

分 类 号：TB381[一般工业技术—材料科学与工程]