聚酰胺改性氢化蓖麻油在无铅锡膏中的应用研究  

Study on Polyamide Modified Hydrogenated Castor Oil Applied in Lead-free Solder Paste

作　　者：葛晓敏[1] 熊国宣[1] 马鑫 

机构地区：[1]东华理工大学,江西南昌330013 [2]深圳市亿铖达工业有限公司,广东深圳518101

出　　处：《广州化工》2013年第24期76-78,共3页GuangZhou Chemical Industry

摘　　要：通过试验,在免洗松香型无铅锡膏中添加聚酰胺改性氢化蓖麻油,考察其对焊锡膏流变性能及应用性能的影响。其中,测试方法包括粘度、粘着力和抗热塌性测试。聚酰胺改性氢化蓖麻油用量为5 g时的焊锡膏的粘度适中、粘着力最大及其抗热塌性最好,会有一个较好的印刷性能。Through experiment, by adding polyamide modified hydrogenated castor oil to the no - clean rosin lead - free solder paste, the effect of it on the rheology and application performance of solder paste are studied. These method include viscosity, tack and thermal anti - slump tests. While the dosage of polyamide modified hydrogenated castor oil was 5 g in solder paste, the corresponding viscosity value is moderate, as well as the tack value is biggest and thermal anti - slump of is best, thus it has a good printing performance.

关 键 词：酰胺改性氢化蓖麻油 无铅锡膏 流变性能 应用性能 

分 类 号：TQ323.6[化学工程—合成树脂塑料工业]