试验设计方法在超声楔形焊工艺优化中的应用  

Application of DOE in the optimization of Ultrasonic Wedge Bond Process

作　　者：程顺昌[1] 王晓强[1] 吕玉冰[1] 谷顺虎 

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2013年第6期987-989,共3页Semiconductor Optoelectronics

摘　　要：采用实验设计方法对超声楔形焊引线键合工艺进行实验设计,研究了超声功率、键合压力和键合时间对键合强度的影响,得到了拟合程度好的统计模型和优化后的超声楔形焊工艺参数。在最优的工艺条件下,键合质量得到了提高。Experiments were carried out to investigate the effects of ultrasonic power,bonding press and bonding time on the strength of ultrasonic wedge bonding with the method of design of experiment（DOE）,and the statistic model with good fitting degree and optimized parameters was obtained.As the result,the bonding quality was improved with the optimized parameters.

关 键 词：试验设计方法 超声楔形焊 统计模型 

分 类 号：TN605[电子电信—电路与系统]