FBGA封装阵列制造工艺过程的翘曲研究  

Warpage analysis of FBGA packaging during assembling process

作　　者：刘培生[1,2] 仝良玉[1] 沈海军 陶玉娟 黄金鑫[1] 缪小勇 

机构地区：[1]南通大学江苏省专用集成电路设计重点实验室,江苏南通226019 [2]南通富士通微电子股份有限公司,江苏南通226006

出　　处：《电子元件与材料》2014年第1期48-51,共4页Electronic Components And Materials

基　　金：江苏省高校自然科学重大基础研究资助项目(No.10KJA40043);南通大学自然科学研究资助项目(No.2010K121);南通大学研究生科技创新计划资助项目(No.YKC12072);江苏省研究生科技创新计划资助项目(No.CXZZ12_0864)

摘　　要：采用有限元分析法,就一款1-block形式的FBGA封装阵列产品在注塑成型过程中所经历的带状翘曲现象进了预测分析,并用测试结果验证了有限元分析的有效性。在此基础上,从理论方面分析了材料性能对封装翘曲的影响,并对塑封料CTE参数进行了优化分析和仿真验证。最后,分析了芯片的排列形式对封装翘曲的影响。The strip warpage of a 1-block style FBGA during the molding process was predicted and analyzed by using finite element method （FEM）, and the simulation result was validated by the test result. The effects of material properties to the warpage were also theoretically analyzed based on the above result. The CTE of molding compound was optimized and verified by simulation results. The effect of die arrangement to the warpage was also discussed in the last part.

关 键 词：细间距球栅阵列封装 有限元方法 翘曲变形 热膨胀 组装工艺 温度变化 

分 类 号：TN402[电子电信—微电子学与固体电子学]