IGBT模块回流焊工艺中预翘曲铜基板的研究  

Study of Pre-warpage Cu Substrate of IGBT Module in Reflow Process

作　　者：周洋[1] 徐玲[1] 张泽峰[1] 陈明祥[1] 刘胜[1] 

机构地区：[1]华中科技大学机械学院,武汉430074

出　　处：《中国电子科学研究院学报》2013年第6期578-582,共5页Journal of China Academy of Electronics and Information Technology

基　　金：国家863高技术基金项目(2011AA050401)

摘　　要：IGBT模块铜基板的平整度对于模块的可靠性至关重要,在工业生产中,往往会通过机械的方法使平整的铜基板预翘曲成凹形,从而达到使铜基板在回流焊之后变得平整目的。基于Anand粘塑性模型,通过有限元的方法建立回流焊工艺模型分析整个回流过程中铜基板翘曲变化。研究了DBC铜层图形对因回流引起的铜基板翘曲的影响,分析了铜基板预翘曲量对回流中基板翘曲变化的影响。研究结果表明,铜层图形对回流中铜基板翘曲的影响较小,预翘曲量的大小对回流中铜基板翘曲变化方向影响较小,回流中基板翘曲变化量近似为一常数。一种有效地分析回流焊工艺过程的方法被提出,为封装工艺工程师提供了重要参考,对工业生产具有重要的指导意义。The roughness of Cu substrate in IGBT module is very important for the reliability of the mod- ule. In industry Cu substrate always is warped concavely by mechanical methods to flatten Cu substrate after reflow process. Based on Anand model, a finite element model of the reflow process was modeled to study the warpage of Cu substrate in reflow process. The impacts of the copper graphics in DBC and the value of the pre-warpage to the warpage of Cu substrate were studied. The results reveal that the value and the direction of deformation developed in Cu substrate due to reflow process are not depend on the value of the pre-warpage. An effective method to research the reflow process was proposed in this paper. This method, can be applied by package engineers, is very important for IGBT packaging industry.

关 键 词：IGBT 预翘曲 回流焊 铜基板 

分 类 号：TN305[电子电信—物理电子学]