电子行业中复合材料导热模型及机理研究进展  

Research Progress of Thermal Model and Mechanism of Composite Materials in Electronics Industry

作　　者：王昆[1] 刘晓剑[1,2] 王玲 万超 郭高航 戴雨[1] 

机构地区：[1]哈尔滨工业大学深圳研究生院,广东深圳518129 [2]中国电器科学研究院有限公司,广东广州510300

出　　处：《电子工艺技术》2014年第1期11-14,36,共5页Electronics Process Technology

基　　金：广东省国际合作项目(项目编号:2012B050500010)

摘　　要：随着电子信息产业的快速发展,电子器件和封装材料的散热及综合性能要求越来越高,因此寻求高导热、高性能的复合材料成为电子行业中一个研究趋势。从导热模型、导热机理、如何提高热导率三个方面对电子工业领域中所用高分子复合材料进行了总结。With the rapid development of electronic information industry, the requirements of thermal and comprehensive performance for electronic components and packaging materials are higher and higher, thus seeking composite materials with high thermal conductivity and high-performance has become a research trends in the electronics industry. Summarize the polymer composites used in electronics industry from three aspects of the thermal conduction model, thermal conduction mechanism, and how to improve the thermal conductivity.

关 键 词：复合材料 导热模型 导热机理 

分 类 号：TN305.94[电子电信—物理电子学]