Sn-Zn-Bi无铅钎料的研究现状  

Research status of Sn-Zn-Bi solders

作　　者：赵东升[1] 

机构地区：[1]机械科学研究院哈尔滨焊接研究所,150028

出　　处：《焊接》2014年第1期47-53,70-71,共7页Welding & Joining

摘　　要：综合介绍了国内外对Sn-Zn-Bi钎料的研究现状,阐述了Sn-Zn-Bi系钎料的熔化特性、润湿性能、力学性能等,总结出对Sn-Zn-Bi系钎料的改善措施。由于Bi元素的添加,Sn-Zn-Bi钎料会有较低的熔点、较高的抗拉强度,并且润湿性能略有提高,但造成熔化温度区间的提高以及塑性的降低,同时可能会出现焊点剥离现象等造成焊接性降低。因此,可以选择添加第四组元或者选取适当的冷却速度改善上述缺点。The study status of Sn-Zn-Bi solders was comprehensively introduced.The melting characteristics,wettability and mechanical properties were discussed.At last,the appropriate improvement measures were introduced.The addition of Bi can improve the wettability,decrease the melting point,and enhance the tensile strength partially.However,which leads to the broadening of the melting temperature range and the obvious decrease of the ductility.Also it can form the phenomenon of fillet lifting.Addition of quaternary trace or RE elements and appropriate cooling rate can be recommended to improve the disadvantages in this article.

关 键 词：无铅钎料 钎料性能 界面 改善措施 

分 类 号：TG425[金属学及工艺—焊接]