微胶囊技术在粘接涂层自修复中的应用  

Microencapsulation technology application in adhesive coating self-healing

作　　者：王洪祚[1] 王颖[1] 

机构地区：[1]武汉大学化学与分子科学学院,湖北武汉430072

出　　处：《粘接》2014年第1期71-74,共4页Adhesion

摘　　要：微胶囊技术是21世纪重点研究开发的高新技术之一,用途广泛。将其与粘接技术相结合,不仅增加产品的附加值更是获得新特性胶粘剂的新途径。本文简要介绍了微胶囊技术在粘接涂层自修复中的应用原理及研拓进展。指出了其未来研发的难点、方向。,Microencapsulation is one of the high ＆ new technologies in twenty-first Century, a wide range of uses. Combined with the bonding technology, not only increase the added value of the product, more is a new method to obtain new properties of adhesive. This paper briefly introduces the principles of self repair and expands research progress for the application of microcapsule technology in adhesive coating. Point out the future direction of researching and developing difficulties.

关 键 词：微胶囊 粘接涂层 自修复 

分 类 号：TQ491[化学工程]