多晶硅还原炉底盘温度场均匀性分析  

Analysis of temperature field uniformity on polysilicon reduction furnace chassis

作　　者：王晓静[1] 崔萌[1] 张芳[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《现代化工》2014年第2期160-163,共4页Modern Chemical Industry

摘　　要：针对一种24对棒多晶硅还原炉底盘的冷却模式,应用Fluent对多晶硅还原炉底盘内流体进行模拟分析,得出底盘的上花板温度分布图,并引入平均算数温度和均匀系数的概念分析底盘温度场的均匀性。总结概括出温度场均匀性分布随冷却液进口流量的变化趋势,提出判别温度场均匀化的判据,提供合适的流量参考。According to a cooling mode of 24 rods polysilicon reduction furnace chassis,the software Fluent is used to simulate the fluid in the chassis of the furnace.The temperature field distribution of the upper board of chassis is drawn and introduced the concept of Arithmetic Average Temperature and Uniformity Coefficient to analyze the temperature field uniformity of the chassis.Finally,the trend that temperature field uniformity is changed along with the inlet flow of cooling fluid is summed up.The criterion of judging temperature field uniformity is put forward with an appropriate cooling flow as reference.

关 键 词：多晶硅还原炉 底盘 温度场 均匀系数 

分 类 号：TK175[动力工程及工程热物理—热能工程]