Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes  

作　　者：Chaolei Huang Hongjiang Zeng Xiaojun Tian Jie Liu Zaili Dong Tie Li Yuelin Wang 

机构地区：[1]State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences [2]University of Chinese Academy of Sciences [3]Science and Technology on Micro-system Laboratory and State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences

出　　处：《Chinese Science Bulletin》2014年第5期577-584,共8页

基　　金：supported by the National Natural Science Foundation of China(51375477 and 61375091);the CAS FEA International Partnership Program for Creative Research Teams

摘　　要：At present,study on dynamic tensile properties and atomic chain fabrication of single nanowire,for understanding its dynamic tensile properties and unique physical properties of atomic chain to fabricate atom scale devices,is one of frontier research issues in nanoscale science.However,how to assemble single nanowire on a tensible microstructure becomes one of the most difficult problems,which severely restricts the development of this research field.In this paper,after the ultrahigh tensible microelectrode chip is fabricated by MEMS technology,hexamethyldisilazane is utilized to improve hydrophobicity of the chip,and then a microdroplet dielectrophoresis experimental platform and technology is developed to assemble single nanowire on the sensible microelectrode.Experimental results show that accurate and efficient assembly of single Cu nanowire is realized,which contribute greatly to the further research of dynamic tensile properties and atomic chain fabrication.And for guiding the assembly experiments,finite element technology is also utilized to analyze the local microelectro field around the microelectrodes during dieletrophoresis experiments.At present, study on dynamic tensile properties and atomic chain fabrication of single nanowire, for understanding its dynamic tensile properties and unique physical properties of atomic chain to fabricate atom scale devices, is one of frontier research issues in nanoscale science. However, how to assemble single nanowire on a tensible microstructure becomes one of the most difficult problems, which severely restricts the develop- ment of this research field. In this paper, after the ultrahigh tensible microelectrode chip is fabricated by MEMS technology, hexamethyldisilazane is utilized to improve hydrophobicity of the chip, and then a microdroplet dielectrophoresis experimental platform and technology is developed to assemble single nano- wire on the sensible microelectrode. Experimental results show that accurate and efficient assembly of single Cu nanowire is realized, which contribute greatly to the further research of dynamic tensile properties and atomic chain fabrication. And for guiding the assembly experiments, finite element technology is also utilized to analyze the local microelectro field around the microelectrodes during dieletrophoresis experiments.

关 键 词：电泳实验 纳米线 微电极 组装 介电 微滴 动态拉伸性能 MEMS技术 

分 类 号：TB383.1[一般工业技术—材料科学与工程]