纳米改性水基助焊剂的制备与研究  

Preparation and Study on Nano-modification Water-Based Flux

作　　者：王爱军[1] 孙初锋[1] 

机构地区：[1]西北民族大学化工学院,甘肃兰州730124

出　　处：《热加工工艺》2014年第5期178-180,共3页Hot Working Technology

基　　金：国家自然科学基金资助项目(51167017)

摘　　要：采用自制的纳米银抗菌剂作为防霉抗菌添加剂,制备出了纳米改性水基助焊剂,并进行了可焊性和焊后可靠性测试。结果表明,该纳米改性水基助焊剂在可焊性测试开始后通过校正零轴的沾锡时间为1.4 s,最大润湿力为3.48 mN;经过24、96和168 h的潮热(85℃/85%RH)试验后,梳型电极未清洗条件下的表面绝缘电阻值最小值为2.1×109Ω,且表面无任何树枝状结晶物生成,远高于IPC-J-STD-004A标准要求值,具有优异的可焊性和焊后可靠性。Abstraet：Nano modification water-based flux was prepared with homemade nano silver bactericide as anti-fungus and anti-mildew agent. Moreover, the solderability and reliability after soldering were tested. The results show that a wetting time for the wetting curve to cross the corrected zero axis after the start of the test is 1.4 s, the maximum wetting force is 3.48 raN, the minimum surface insulation resistance of comb shaped electrode without cleaning after reliability test for 24 h, 96 h and 168 h at 85℃/85%R-H is 2.1×10^9Ω, and there is non dendrite growth on the surface of the comb shaped electrode, and it is higher than the requirement for the standard of IPC-J-STD-004A. The nano-modification water-based flux has excellent solderability and reliability after soldering. Key words ：nano modification; water-based flux; preparation; solderability; reliability after soldering

关 键 词：纳米改性 水基助焊剂 制备 可焊性 焊后可靠性 

分 类 号：TG425.1[金属学及工艺—焊接] TQ316.63[化学工程—高聚物工业]