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作 者:陈智利[1,2] 刘卫国[1,2] 张锦[2] 王蒙皎
机构地区:[1]西安电子科技大学微电子学院,西安710064 [2]西安工业大学光电工程学院,西安710032
出 处:《光子学报》2014年第1期82-86,共5页Acta Photonica Sinica
基 金:欧盟第七科技框架玛丽居里计划项目(No.247644);国防基础科研计划(No.A0920110016);陕西省教育厅科学研究项目(No.12JK0469);西安工业大学校长基金(No.XAGDXJJ1002)资助
摘 要:利用离子柬溅射诱导实验方法,在单晶Si(100)基底上辅助沉积银膜,研究了低能Ar+离子束30。入射时,不同离子束能量和束流密度以及基底温度对Ag纳米结构的影响.结果表明:在较低基底温度下(32~100℃)辅助沉积银膜,膜层表面会呈现排列紧密、晶粒尺寸一致的金字塔状纳米结构.当温度升高时(32~200℃),纳米微结构横向尺寸λ2迅速增加,而粗糙度先减小(32~100℃)后迅速增大(100~200℃);当离子束能量1400eV、束流密度15~45uA/cm2时,在相同温度下,随着离子束束流密度的增大,纳米晶粒横向尺寸基本不变,粗糙度略有增加;当离子柬流密度为15μA/cm2、能量1000~1800eV时,在相同温度下,随着离子束能量的增加,银纳米结构尺寸增加,而表面粗糙度先增加,然后缓慢减小.自组织纳米结构的转变是溅射粗糙化和表面驰豫机制相互作用的结果.Ion beam sputtering induced experimental method was used to assist the silver film deposition on monocrystalline silicon(100) and the induced deposition effects of low energy Ar+ ion beams was discussed with different ion energies, fluxes and substrate temperatures at the ion incidence angle of 30°. The experiment indicated that temperature change had significant influence on the nano microstructure size and roughness. When the substrate temperature was between 32℃and 100℃, the closely packed nano pyramid microstructures were obtained with grains consistent in size; when the substrate temperature rose between 32℃ and 200 C , the microstructures transverse size (a~) of samples increased rapidly, but the roughness decreased at first (32-10℃), and then increased rapidly (100-200℃). When ion flux density was within 15-45 μA/cm2 with an ion beam energy of 1 400 eV, the increase of ion beam flux densities at the same deposition temperature could achieve the nano crystal grains with unchanged lateral sizes and more compact arrangement, and slightly increased roughness; when ion beam energy was within 1 000 - 1 800 eV with an ion beam flux of 15 μA/cm2, the increase of ion beam energies could lead siIver nano microstructure sizes to increase, and the surface roughness of samples to increase first and then decrease slowly. The pattern transformation of self-organizing nano structure results {rom the interaction of spurting roughening and relaxation mechanism.
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