内嵌于多层封装基板的折叠波导慢波结构设计  

Design of folded waveguide slow- wave structure embedded in multilayer package substrate

作　　者：姚雅婷[1] 缪旻[1,2] 

机构地区：[1]北京信息科技大学信息微系统研究所,北京100101 [2]北京大学微米/纳米加工技术国家级重点实验室,北京100871

出　　处：《北京信息科技大学学报（自然科学版）》2014年第1期43-47,共5页Journal of Beijing Information Science and Technology University

基　　金：国家自然科学基金资助项目(60976083;61176102);北京市自然科学基金资助项目(3102014);国家重大科技专项基金资助项目(2009ZX02038);北京市属高等学校人才强教计划资助项目(PHR201108257)

摘　　要：提出了一种新型的内嵌于多层封装基板的折叠波导慢波结构。开展了此慢波结构的解析模型、色散特性和耦合阻抗、射频传输特性以及注—波互作用的研究。通过理论分析、数值计算和仿真优化得到了较好的结果。在W波段该结构呈现反射小、损耗低,易于加工等特点。在中心频率94 GHz处色散曲线较为平坦,耦合阻抗值在2Ω左右。同时,对低温共烧陶瓷的材料特性及加工工艺进行了研究,探讨了该结构实现加工的可行性。A novel folded waveguide slow- wave structure embedded in a multilayer package substrate is put forward. The analytical model, dispersion characteristics, coupling impedance, RF transmission characteristics and beam-wave interaction of this slow-wave structure are studied. Improved results are obtained by optimization through theoretical analysis, numerical calculation and simulation. In W-band, this structure presents the characteristics of low reflections, low loss and easy processing, etc. Dispersion curve is relatively flat at the center frequency of 94GHz, and the coupling impedance value is around 2 ohm. Meanwhile, the material properties and processing technologies of LTCC （low temperature co-fired ceramic）are also studied, and the feasibility of the structure microfabrication is discussed.

关 键 词：折叠波导 慢波结构 返波振荡器 低温共烧陶瓷 

分 类 号：TN125[电子电信—物理电子学]