不同应变速率下BGA焊球剪切断裂试验与模拟分析  

Experimental and simulation analysis on shear fracture for BGA solder ball under different strain rates

作　　者：薛明阳[1] 卫国强[1] 金亮[1] 王海燕[1] 

机构地区：[1]华南理工大学机械与汽车工程学院,广州510640

出　　处：《焊接学报》2014年第3期45-48,115,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(广东省联合基金资助项目U0734006);国家自然科学基金资助项目(51371083)

摘　　要：研究了BGA封装Sn-3.0Ag-0.5Cu无铅焊球经115℃时效后,焊球/铜界面IMC的形貌和组织变化,同时对BGA焊球在两种不同应变速率条件下的抗剪强度进行了分析,并运用ANSYS12.0软件对其过程进行2-D非线性有限元模拟.试验结果表明,随着时效时间的延长,界面形貌由时效前的树枝状变成连续平坦的层状、界面IMC不断增厚,且焊球的抗剪强度随着时效时间的增加而不断降低;应变速率越高,抗剪强度越高.模拟结果表明,应变速率越高,焊球经受的抗剪强度越大,Von Mises应力越大,等效塑性应变越小,塑性应变能密度越大.Influence of thermal aging time on the morphology and microstructure of the interfacial IMC for BGA( ball grid array) package between Sn-3. 0Ag-0. 5Cu lead-free solder ball and Cu interface at 115 ℃ were investigated. Meanwhile,the shear strength for BGA solder ball was studied and simulated by ANSYS 12. 0 finite element software with a non-linear finite element model under two different strain rates. The experimental results are as follows: with the increase of the aging time,the morphology of interfacial IMC changes from dendritic to continuous even lamellar,the thickness of interfacial IMC increases continuously and the shear strength of solder ball gradually decreases. Furthermore,the simulation results show that the larger strain rate will result in the higher shear strength,the higher Von Mises stress,the smaller plastic strain and the higher plastic strain energy density.

关 键 词：BGA封装 抗剪强度 应变速率 有限元模拟 

分 类 号：TG454[金属学及工艺—焊接]