基于ANSYS Workbench及Moldflow的精密注射模镶块变形分析  

Deformation analysis for precise injection mould inserts based on ANSYS Workbench and Moldflow

作　　者：宋满仓[1] 许建超 于文强[1] 

机构地区：[1]大连理工大学模塑制品教育部工程研究中心,辽宁大连116023

出　　处：《模具工业》2014年第3期6-10,共5页Die & Mould Industry

摘　　要：通过Moldflow模拟注射成型过程,并将分析结果导入有限元分析软件中,定量分析微流控芯片注射模镶块变形量,并结合注射成型试验进行验证。结果表明,芯片厚度不一致是由镶块微变形造成的,在微流控芯片注射成型过程中,模具镶块产生的微变形与最终制品厚度差均在30μm左右,两者变化趋势基本一致。The injection moulding process for micro-fluidic chip was simulated by Moldflow, and the results were used to analyze the inserts＇ deformation in the injection mould by AN SYS Workbench. The obtained numerical and experimental results show that, micro-fluidic chip＇s thickness uniformity defects are caused by the micro deformation of mould inserts, in the moulding process, the micro deformation of mould insert and the final product thick- ness uniformity both reach approximately 30 um, and have the same trend.

关 键 词：微注射成型 微流控芯片 ANSYS WORKBENCH 厚度不均 

分 类 号：TG241[金属学及工艺—铸造] O242.21[理学—计算数学]