Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响  

Effect of Ce on microstructure and properties of Sn-ZnCu lead-free solder alloy

作　　者：张宇航[1] 高瑞军[1] 孙福林[1] 韩振峰[1] 潘凯华[1] 钟茂山 

机构地区：[1]广东省工业技术研究院(广州有色金属研究院),广东广州510650

出　　处：《材料研究与应用》2014年第1期35-38,共4页Materials Research and Application

摘　　要：研究了在适用于铜铝异种金属软钎焊的Sn-1.0Zn-0.7Cu无铅合金焊料中添加微量稀土元素Ce,对合金焊料的钎焊组织和性能的影响。结果表明,当w(Ce)=0.10%时,可明显改善合金焊料对Al母材的润湿与铺展,提高焊点的可靠性。Minute amount of rare earth Ce was added into Sn-1.0Zn-0.7Cu lead-free solder alloy aiming at examining the effect of properties and microstructure of Sn-1.0Zn-0.7Cu solder for forming a perfect sold- ered joint between Cu and A1. The results show that Ce can further improve wettability to Al-base and re- liability, and when the content of Ce reached 0.10%, it was the optimum composition.

关 键 词：稀土 无铅焊料 软钎焊 性能 

分 类 号：TG425.1[金属学及工艺—焊接]