金刚石颗粒化学镀铜工艺优化  

Optimization of electroless copper plating on diamond particles

作　　者：杨伟锋[1] 申文浩[1] 童国庆[1] 仲洪海[1] 蒋阳[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《电镀与涂饰》2014年第8期338-342,共5页Electroplating & Finishing

摘　　要：以KBH4为还原剂、CuSO4为氧化剂,对金刚石颗粒进行化学镀铜。研究了pH、亚铁氰化钾含量、甲醇以及镀覆时间对镀液稳定性和化学镀铜沉积速率的影响。利用X射线衍射仪、场发射扫描电镜、能谱仪表征了镀铜金刚石颗粒的成分、表面形貌和晶粒大小。结果表明,采用硼氢化钾体系能够在金刚石颗粒表面镀覆晶粒细小(约35 nm)且较薄(约210 nm)的铜层。pH对镀液稳定性的影响较大:随着pH的升高,镀液稳定性显著增强;但pH过高会降低沉积速率,且不利于镀层增厚。亚铁氰化钾具有整平铜层和细化晶粒的作用,而甲醇能抑制副反应,提高沉积速率,两者联用能够保证镀液稳定性和镀层表面质量。Diamond particles were electrolessly plated with copper using KBH4 as reductant and CuSO4 as oxidant. The effects of pH, K4Fe（CN）6 content, CHaOH content, and plating time on the stability and deposition rate were studied. The composition, surface morphology, and grain size of copper-plated diamond particles were characterized by X-ray diffractometer, field emission scanning electron microscope, and energy-dispersive X-ray spectrometer. The results indicated that a thin （ca.210 nm） copper coating with fine grain size （ca.35 nm） can be obtained on the surface of diamond particle from the KBH4-based system, pH has great effect on the stability of plating bath. With the increasing of pH, the stability of plating bath is improved remarkably. However, when the pH is too high, the deposition rate is decreased and the thickening of coating becomes difficult. K4Fe（CN）6 has leveling and grain refining effects on copper coatings. CH3OH can inhibit the side reaction and improve the deposition rate. The stability of plating bath and the of electroless copper coating can be assured with the combination of K4Fe（CN）6 and CH3OH.

关 键 词：金刚石 化学镀铜 硼氢化钾 复合粉体 表面形貌 

分 类 号：TQ153[化学工程—电化学工业] TQ178