密集孔PCB板电镀参数探讨  

Plating parameter study on high density hole PCB

作　　者：韦国光 王根长 杨海波 姚国庆 

机构地区：[1]深圳华祥荣正电子有限公司,广东深圳518103 [2]九江华祥科技股份有限公司,江西九江332000

出　　处：《印制电路信息》2014年第4期42-44,共3页Printed Circuit Information

摘　　要：PCB电镀参数最终决定成品的铜厚,一般情况下,全板电镀成品的铜厚与药水深镀能力、产品尺寸、电镀设备效率息息相关。与此同时,产品孔密度分布同样对最终电镀完成铜厚有很大的影响,本文将从PCB孔密度分布的要素展开分析,从而阐述不同孔密度分布对电镀的影响。PCB plating parameters will determine the product finished copper thickness, under normal circumstances, electroplating products full board finished copper thickness and drops TP ability, product size, electroplating equipment efifciency are closely related to. At the same time, hole density distribution also copper thickness have great impact on the final plating is completed, this paper will analyze from PCB hole density distribution of the elements, which explains the different hole density effects on electroplating.

关 键 词：电镀参数 深镀能力 孔密度 电镀效率 

分 类 号：TN41[电子电信—微电子学与固体电子学]