HDI板高厚径比微盲孔跨层微导通孔技术开发  

Research on the techniques of skip-μvia with high aspect ratio micro-blind hole on HDI board

作　　者：吴军权 刘继承 陈春 黄建航 

机构地区：[1]惠州市金百泽电路科技有限公司,广东惠州516083 [2]深圳市金百泽电路科技股份有限公司,广东深圳518000

出　　处：《印制电路信息》2014年第4期178-182,共5页Printed Circuit Information

摘　　要：高厚径比微盲孔的HDI板制作通常需要很好的孔金属化能力保障其导通可靠性,但所需生产设备及其配套成本让不少厂商望而却步。本文所述高厚径比微盲孔跨层微导通孔(skip-μvia)技术,通过定位精度控制、激光钻孔参数调整以及制板流程优化等工艺的开发,能以更低的成本、更高的品质、更短的加工流程以及常规孔金属化设备实现高厚径比的微盲孔制造,从而降低了高厚径比微盲孔HDI板制造的难度。The micro-blind hole production with high aspect ratio usually requires a strong capability of hole metallization to ensure its connected reliability, but the cost of the necessary equipment and supporting was very expensive for many manufacturers. Herein the techniques of skip-μvia with high aspect ratio micro-blind hold, we can achieve the manufacturing of high aspect ratio micro-blind hole with lower cost, higher quality, shorter machining processes and conventional hole metallization equipment ,through techniques research of positioning precision control,laser-drill parameter adjustment and manufacturing process optimization.Then the manufacturing dififculty of HDI board with high aspect ratio micro-blind hold can be reduced.

关 键 词：高厚径比 微盲孔 跨层微导通孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]