磁控溅射金基合金靶材的制备、应用及发展趋势  

Manufacture,Application and Trends of Gold-base Sputtering Target Alloys

作　　者：张勤 张俊凯[1] 厉英[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110004

出　　处：《材料导报》2014年第5期16-19,共4页Materials Reports

基　　金：国家科技支撑计划(2012BAE06B05)

摘　　要：磁控溅射金基合金镀膜材料以其特有的性能和特点,应用范围越来越广。作为源材料,金基合金靶材的质量对溅射工艺及镀膜性能起着至关重要的作用。主要介绍常用金基合金的种类;金基合金溅射靶材的制备方法及应用现状;高端金基合金溅射靶材制备的技术要求、存在的问题及未来的发展思路。For the reason of outstanding performance and unique character, gold-base coating materials pro- duced by magnetron sputtering were used widely and widely. As the source bulk material for coatings, the quality of gold-base target alloys has great effects on sputtering technique and properties of coatings. Some conventional type of gold-base alloys, making technology of gold-based sputtering target material as well as the status of their development and application, and the technical requirement of making advanced gold-base sputtering target materials are reviewed. Furthermore, the existing problems and developing trends in the future are also discussed.

关 键 词：金基合金 磁控溅射 靶材 技术要求 

分 类 号：TG146.1[一般工业技术—材料科学与工程]