环氧复合材料粘接层对LED灯结温的影响  

Effects of Epoxy Composites Adhesive Layer on Junction Temperature of LED

作　　者：牟其伍[1] 巨虹宗 冉庆[1] 

机构地区：[1]重庆大学物理学院,重庆401331

出　　处：《材料导报》2014年第6期145-148,共4页Materials Reports

基　　金：重庆市国际科技合作计划项目(cstc2012gg-gjhz50001)

摘　　要：采用自制的环氧树脂复合材料作为LED中的粘接材料,利用有限元软件COMSOL模拟讨论LED中粘接层厚度和导热系数对结温的影响,并给出了在粘接层材料的影响下LED灯中的温度分布。B4C的加入使得环氧复合材料(粘接层)热导率大幅度提高,模拟结果表明结温会随粘接层厚度的增加而升高,随着粘接层热导率的增加呈现先快速降低而后缓慢降低的趋势,并给出最佳的厚度和复合材料配比。A self-made epoxy composite was used as the adhesive layer material of high power light emitting diode （LED） packaging.The detailed analyses about effects of the thickness and thermal conductivity of the epoxy resin composites on the junction temperature worked out by the infinite element method COMSOL was listed.Also the infinite element method COMSOL provides an detailed temperature distribution of the LED packaging model with the variable adhesive layer materials.Adding B4C particles into the matrix （epoxy resin） can improve the thermal conductivity of epoxy composites （the adhesive layer） sharply.As a result,the junction temperature increases with an increased thickness of the adhesive layer composites and improvement of the thermal conductivity of the adhesive layer composites brings out an variation tendency of decrease rapidly at first and slowly later.At last,the optimum thickness of the adhesive layer and mass fraction of the composites were obtained.

关 键 词：环氧复合材料 热导率 温度分布 结温 

分 类 号：TB332[一般工业技术—材料科学与工程]