石英玻璃真空腔的低温键合技术研究  

Low Temperature Bonding of Quartz Glass for Vacuum Chamber Made of Glass

作　　者：李攀[1] 张晋宽[1] 李俊[1] 雷兴[1] 刘元正[1] 王继良[1] 

机构地区：[1]西安飞行自动控制研究所,西安710065

出　　处：《真空科学与技术学报》2014年第3期230-234,共5页Chinese Journal of Vacuum Science and Technology

基　　金：总装十二五空支撑技术项目(61901060301)

摘　　要：用于制造石英玻璃真空腔的低温键合技术受到了广泛的重视。该技术基于氢氧化物催化玻璃表面的水解/脱水过程,通过在键合界面之间形成硅酸盐三维网状结构实现键合,是一种高强度、高精确性、可靠的室温键合方法。本文简述了国际上低温键合技术的研究动态,对石英玻璃低温键合技术的工作原理进行了阐述,并设计了石英玻璃低温键合的详细实施步骤。通过对键合溶液浓度、键合过程、加速固化方法等关键工艺参数的分析和研究,实现了石英玻璃的低温键合,键合强度超过2.88 MPa,而键合界面与光胶一样均匀、透明。利用低温键合技术形成石英玻璃真空腔,漏率优于5×10-10A novel technique was developed to bond a quartz glass part to the glass vacuum chamber at a low tem- perature. The physical and chemical processes and the interfacial microstructttres involved in the bonding were tentatively discussed. The hydrolyzation and dehydration, catalyzed by the hydroxide solution on the quartz glass surfaces at an elevat- ed temperature, result in formation of the 3-dimnsional, net-shaped silicate bond at the joint. The quartz glass bond pos- sesses high strength, high precision, and high stability. The impacts of the bonding conditions, such as the concentration of the bonding solution, environmental cleanness, and solidification time, etc, on the quartz glass bond were experimentally evaluated. Under the optimized conditions, the fairly uniform, transparent quartz glass joint was obtained with a bonding strength over 2.88 MPa and a leak rate below 5 × 10^-10 Pa· L/s.

关 键 词：石英玻璃 真空腔 低温键合 水解 脱水 

分 类 号：TN204[电子电信—物理电子学]