电子封装用diamond/Al复合材料研究进展  

Research progress of diamond/aluminum composites for electronic packaging

作　　者：马如龙[1] 彭超群[1] 王日初[1] 张纯[1] 解立川[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《中国有色金属学报》2014年第3期689-699,共11页The Chinese Journal of Nonferrous Metals

基　　金：湘财教指[2013]70号

摘　　要：Diamond/Al复合材料作为第四代电子封装材料,具有高热导率、低热膨胀系数和低密度等优良性能,成为研究重点。论述diamond/Al复合材料研究概况,分析挤压铸造、浸渗法和放电等离子烧结制备方法的优点和缺点,讨论热导率和热膨胀系数等热物理性能的影响因素,并对其发展前景进行展望。Diamond/aluminum composites, the fourth generation of electronic packaging materials, have attracted much attention for their remarkable comprehensive properties, such as high thermal conductivity, low coefficient of thermal expansion and low density. The research situation in diamond/aluminum composites was surveyed, and the advantages and disadvantages of the preparation processes that include squeeze casting, infiltration and spark plasma sintering were analyzed. Factors related to thermophysical properties, such us thermal conductivity and coefficient of thermal expansion were discussed. Finally, the relevant problems and development tendency were also addressed.

关 键 词：电子封装 DIAMOND AL复合材料 热导率 热膨胀系数 

分 类 号：TB333[一般工业技术—材料科学与工程]