焊料种类及焊缝显微形貌对焊接钎着率的影响  

Effects of Solder Species and Weld Microstructures on Brazing

作　　者：魏志君[1] 陈乐生[2,3] 申乾宏[1,2] 张玲洁[1] 杨辉[1,2] 樊先平[1] 吴新合 向文之 

机构地区：[1]浙江大学材料科学与工程学系,杭州310027 [2]浙江大学浙江加州国际纳米技术研究院,杭州310029 [3]温州宏丰电工合金股份有限公司,浙江乐清325603

出　　处：《电工材料》2014年第2期3-7,共5页Electrical Engineering Materials

基　　金：国家高技术研究发展计划(863计划)(2013AA031803)

摘　　要：以AgCdO电接触复合材料为触点材料,黄铜为底板,通过电阻钎焊实现触头和底板的焊接。采用JTUIS-IV超声成像无损检测仪、金相显微镜、扫描电子显微镜(SEM)等测试手段,研究焊料种类及焊缝显微形貌对钎着率的影响。结果表明,不同焊料在焊接过程中会表现出不同的作用效果;钎着率较高的工件中仍然存在裂缝、夹杂等微观缺陷,且该缺陷主要存在于铜与焊料的结合层;第二相石墨的加入会明显降低钎着率并极大地损害材料的焊接性能;采用Ag25CuP和无银焊剂焊接后,焊缝过渡层均呈现树枝状晶体组织,但形貌差异较大。In this paper, different solders were used to weld the contact terminal AgCdO and brass H62 bridge. Metaloscope, scanning electronic microscopy and ultrasonic scan machine were applied to investigate effects of solder species and weld microstructures on brazing and weld properties. Results show that different species of solder make various effects in the welding process. Brazing is not relevant with microstructure. For instance, the brazing shows a high value, but there are still some defects, such as cracks and impurities, and these defects always exist in the connection between braze and solder. Moreover, the existence of the graphite can degrade the brazing seriously and is harmful to the weld properties. When Ag25CuP and solder without silver are used, the microstructures of welding joints both show fern-leaf crystal, but are different.

关 键 词：焊料 显微形貌 钎着率 焊接 

分 类 号：TG42[金属学及工艺—焊接]