BGA焊点纳米压痕实验有限元模拟分析  

Finite Element Simulation Analysis of BGA Solder Joint Nano-Indentation Experiment

作　　者：王丽凤[1] 刘阁旭 戴洪斌[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《电子工艺技术》2014年第2期66-69,97,共5页Electronics Process Technology

基　　金：黑龙江省教育厅基金项目(项目编号12521068)

摘　　要：采用有限元方法模拟了BGA焊点的纳米压痕实验的加、卸载过程,并根据得出的应力应变分布云图,通过分析从各关键部位提取的应力应变随时间变化的关系,对焊点发生失效的位置及蠕变特征进行了讨论。首先建立BGA单个焊点的模型,设定其几何参数、边界条件、材料特性与加载方式,然后利用有限元分析工具MARC进行计算与标准试样实验结果相比较,通过反复修正应力-应变关系曲线,直至分析所得载荷-位移曲线与试验曲线很好地吻合,证实了模拟的可靠性,研究结果对焊点的可靠性评估有一定的指导意义。The load-unload process of nano-indentation BGA solder joint was simulated by finite element method. In the finite element analysis, extracting the stress-strain variation with time and stress and strain contours, the failure of solder joint position and creep characteristics were discussed. Firstly established finite element model of BGA assembly single Solder Joint, then set its geometric parameters, boundary conditions, material properties and load mode, finally analyzed the experimental and simulation results of the load-depth curve, corrected repeatedly stress-strain curves, the analysis was proceeded until the load-displacement curve in good agreement with the experimental curve to verify the reliability of the simulation. The findings on the design and evaluation of the reliability of solder joint have some significance.

关 键 词：纳米压痕 有限元方法 压力载荷 应力应变 

分 类 号：TN60[电子电信—电路与系统]