大功率LED模组散热基板结构研究  

Study on Structure of Heat-Sinking Substrate for High-Power LED Module

作　　者：黄建国[1] 刘斌[1] 欧文 张衡明 王向展[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610000 [2]科磊得数码光电科技有限公司,广东东莞523000

出　　处：《微电子学》2014年第2期229-232,共4页Microelectronics

基　　金：广东省战略性新兴产业专项资金LED产业资助项目(CXY2011053)

摘　　要：大功率LED模组散热直接影响其光效和使用寿命。通过建立相应的有限元模型,运用有限元(FEM)分析方法,对大功率LED模组温度在散热基板内的分布进行模拟计算,采用嵌入高导热环的基板结构,提高大功率LED模组的散热效率。在此基础上,结合实际工艺,对高导热环结构参数的影响进行了详细分析,使导热环的尺寸和基板的散热效率达到最优。Heat dissipation is one of the key issues in application of high-power LED modules,since it has direct effects on light efficiency and lifetime of the device.Finite element model was established and the finite element method（FEM）was adopted to compute temperature distribution on heat-sinking substrate for high-power LED module.A highly heat conductive ring was embedded into the substrate around the LED chip to improve its heat dissipation efficiency.Based on practical process,effects of structural parameters of the heat-conductive ring were studied to optimize the ring size for better heat dissipation efficiency.

关 键 词：大功率LED模组 散热基板 高导热环 有限元模型 

分 类 号：TN312.8[电子电信—物理电子学]