高频印制板基材发展概况和选型探讨  

Development Situation and Selection Discussion of Substrate Materials for High Frequency PCB

作　　者：方庆玲[1] 吴小龙[1] 吴梅株 胡广群[1] 徐杰栋[1] 

机构地区：[1]无锡江南计算技术研究所,江苏无锡214083

出　　处：《绝缘材料》2014年第1期17-21,共5页Insulating Materials

基　　金：国家科技重大专项(2011ZX02709-002)

摘　　要：概述了高频基材的发展现状,重点探讨了其选型原则,并介绍了高频印制板对基材的介电常数(Dk)、介质损耗因数(Df)、铜箔表面粗糙度等方面提出的特殊要求,最后分析了全球主要高频基材供应商的相关产品材料组成及其介电性能。The development situation of substrate materials for high frequency printed circuit board （PCB） was summarized, and the selection principle of substrate materials was mainly discussed. The special re-quirements of high frequency PCB on the dielectric loss（Dk）, dielectric dissipation factor（Df） and surface roughness of copper foil of the substrate materials were introduced, and the material composition and di-electric properties of relative products from global main high frequency substrate materials supplier were analyzed.

关 键 词：高频 基材 介电常数 介质损耗 表面粗糙度 

分 类 号：TM215[一般工业技术—材料科学与工程] TN41[电气工程—电工理论与新技术]