Ni-P-SiC化学复合镀  

Research of Ni-P-SiC Complex Chemical Plating

作　　者：李义和[1] 傅圣利[1] 王本根[1] 王清华[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《国防科技大学学报》2000年第5期33-36,共4页Journal of National University of Defense Technology

摘　　要：采用化学共沉淀法对Ni P SiC化学复合镀研究 ,通过能谱仪和扫描电镜分析了镀层的组成与形貌 ,并对镀层的硬度、耐腐蚀性能进行了研究。结果表明 ,镀层硬度随SiC微粒浓度加大而增加 ;镀液中SiC微粒的浓度和镀液的pH值对镀层中SiC微粒的含量有影响 ;在SiC浓度为 7 5g/L时镀层中SiC含量达到最大值 1 6 81 % ;而pH值的最佳值为 4 7;同时 ,由于SiC微粒的加入 ,镀层表面色泽变暗 ,外观较粗糙 ,镀层的耐腐蚀性降低。Ni P SiC complex chemical platings were investigated by chemical co deposition method. The composition and surface of the plate were analysized by XSP and SEM. The hardness and anti corrosive abilities were also studied at the same time . The results showed that the plates' hardness increased with the increase of SiC concentration in the plating solutions. SiC concentration of plates were greatly influenced by plating solution concentration and its pH value. SiC concentration of plates got its top value, 16.81%, while SiC concentration in the plating solution was 7.5g/L and plating solution' pH value was 4.7. However, the plates'surface became dim and rough, and the plates' anti corrosive abilities decreased.

关 键 词：化学复合镀 耐腐蚀性 硬度 镍 磷 碳化硅 化学共沉淀法 

分 类 号：TQ153[化学工程—电化学工业]