纳米钯材料的制备及其在PCB化学镀铜中的应用  

Preparation and application of nano-palladium material in PCB electroless copper plating

作　　者：张念椿 刘彬云 

机构地区：[1]广东东硕科技有限公司,广东广州510288

出　　处：《印制电路信息》2014年第5期44-47,共4页Printed Circuit Information

摘　　要：以二水合氯化钯为原料,PVP(聚乙烯吡咯烷酮)为分散剂,抗坏血酸(AA)为还原剂,在常温下还原Pd2+制备纳米钯。通过激光动态散射法(DSL),透射电子显微镜(TEM)和X射线衍射仪(XRD)对纳米钯进行了表征分析,结果显示,在PVP分散剂的作用下,得到的纳米钯为粒径8 nm^22 nm,无其他的氧化物存在。该纳米钯材料可作为化学沉铜的活化液,可以减少沉铜的工艺步骤,经过金相显微镜观测化学镀铜后的孔背光级数均达到10级,通过扫描电镜观察镀铜层表面颗粒均匀、平整。所制备的纳米钯是一种优异的化学镀铜活化剂。A nano-palladium activator was successfully prepared at room temperature by the reaction of palladium chloride with dispersing agent PVP （polyvinylpyrrolidone） and reducing agent ascorbic acid （AA）. Dynamic laser scattering （DLS）, transmission electron microscopy （TEM） and X-ray diffraction （XRD） were used to characterize the nano-palladium. It showed that the obtained nano-palladium was diameter 10-20 nm due to the dispersant effect of PVP. And palladium oxide did not exist in it. The nano-palladium materials that can be used as the activation of electroless copper solution. And nano-palladium activation （catalyst） solution can reduce PTH technology. It had excellent back light up to 10 by the optical microscope observation after electroless copper plating in the plated through hole. The surface was uniform particles, coating flat and smooth by using scanning electron microscopy （SEM） to characterize of the surface copper layer. The preparation nano palladium copper sink was an excellent activation solution.

关 键 词：纳米钯 印制电路板 化学镀铜 制备 活化液 

分 类 号：TN41[电子电信—微电子学与固体电子学]