化学镍钯金PCB焊点工艺参数优化实验  

Optimization of Technology Parameter for ENEPIG PCB Solder Joints

作　　者：于金伟[1] 

机构地区：[1]潍坊学院,山东潍坊261061

出　　处：《实验室研究与探索》2014年第4期9-13,17,共6页Research and Exploration In Laboratory

基　　金：国家星火计划项目(2011GA740047);山东省自然科学基金项目(ZR2012EML03);山东省国际科技合作计划项目(201013);山东省高等学校科技计划项目(J12LA57);山东省科技发展计划项目(2011YD16019);山东省潍坊市科学技术发展计划项目(20121115);山东省星火计划项目(2011XH06025)

摘　　要：为提高无铅PCB焊点的可靠性和经济性,业内引入了化学镍钯金PCB,但由于其保护镀层中钯层的加入,形成焊点的工艺参数也需随之改变。分析了影响焊点形成的质量因素,并运用DOE中的稳健实验设计方法设计了实验方案,取得了相关实验数据,从中找到了针对新型化学镍钯金镀层的最优化焊点工艺参数。根据优化结果,改进了形成焊点的工艺参数设置,成功地将化学镍钯金PCB应用到印刷、贴片、焊接工艺中,不但提高了产品的可靠性,还降低了原材料成本,取得了良好的经济效益。In order to improve reliability and economy of lead-free solder joints of PCB , ENEPIG PCB is introduced. Because Pd is joined in protecting involucra, technology parameter of forming solder joints has to be changed The paper analyzed quality factors of affecting solder joint forming, and presented a robust experiment design method by using DOE. It also scientifically designed experiment program. Relevant test data were obtained, and optimal solder joints technology parameter of new type ENEPIG was established. By the technology parameter , ENEPIG PCB is triumphantly used in printing, patch and welding technology. It not only increases reliability of products, but also reduces cost of raw and processed materials and obtains well economy benefit.

关 键 词：镍钯金PCB 焊点 稳健实验设计 焊接 

分 类 号：TG442[金属学及工艺—焊接]