厚膜电路用高性能电阻浆料的研制  

Development and Research of High Properties Resistor Paste for Thick Film Circuit

作　　者：郝武昌 刘敏霞 孙社稷 陆冬梅 

机构地区：[1]西安宏星电子浆料科技有限责任公司,陕西西安710065 [2]西京电气总公司,陕西西安710065

出　　处：《电子工艺技术》2014年第3期131-136,共6页Electronics Process Technology

基　　金：军工科研新品项目

摘　　要：描述了厚膜电路用电阻浆料的研制过程,优化了电阻浆料专用材料体系构成,优选出银/钯粉、二氧化钌粉、钌酸铅粉作为不同阻段电阻浆料的导电相。在大量试验的基础上,选定软化点高中低合理搭配的三种玻璃粉作为粘结相。对作用强大的改性剂成分进行了较全面的分析比较与选用。电阻浆料配方研究采用逐渐添加(或减少)法,逐步逼近标称方阻,获得初级配方,在初级配方基础上继续采用单因素变化法或正交试验进行配方优化。项目研制出了00R系列电阻浆料,其方阻范围宽,稳定性好,工艺适应性强,完全适用于厚膜电路的生产。Describe the development and research process of the thick film resistor paste. The resistor paste material system is optimized. The priority of the Ag / Pd powder, RuO2 powder, Pb2Ru206.5 is used as the conductive phase. The high, middle and low softening point glass powders are selected as the binder phase. The powerful role of modifier component is analyzed and selected widely. The high resistor value segments are studied most importantly in the development process. Single factor changes and orthogonal test method are used for the resistor paste formulation study. The series of OOR resistor pastes has wide range of sheet resistance, well stability and adaptability, is suitable to the manufacture of thick film circuit.

关 键 词：厚膜电路 电阻浆料 材料体系 改性剂 方阻 温度系数 

分 类 号：TN604[电子电信—电路与系统]