IGBT模块空洞率与其温度分布特性关系研究  

Research on Relationship between IGBT Void Ratio and Its Temperature Distribution

作　　者：宋平[1,2] 靳鹏云[1] 郑利兵[1] 花俊[1,2] 韩立[1] 王春雷[1,2] 方化潮 

机构地区：[1]中国科学院电工研究所,北京100190 [2]中国科学院大学,北京100190

出　　处：《现代科学仪器》2014年第2期29-32,共4页Modern Scientific Instruments

基　　金：国家重大专项02专项“高压大功率器件封装与测试平台的设计”（项目号：2011ZX02603）

摘　　要：IGBT模块焊接层空洞会使得模块局部热阻增加、散热能力降低进而导致表面温度场畸变。本文基于红外热像仪和DSP控制单元搭建温度分布检测系统,实现IGBT模块温度场信息的采集、处理和分析。根据实验需要采用自制IGBT模块研究空洞对温度场的影响。通过对不同空洞尺寸的模块进行实验,获得空洞率与温度场分布特性之间的关系。结果表明IGBT模块温度分布特性可以用来进行空洞的定量检测,并给出了根据表面温度特性对IGBT模块性能评估的一般方法。IGBT module welding layer voids would lead to partial thermal resistance increase,cooling capacity reduction,and temperature field distortion.The temperature detection system based on FLIR and the DSP control unit was built in this article to realize the acquisition,processing and analysis of IGBT module temperature field information. Experiments on home-made IGBT modules were done to research the effects of voids on temperature field according to experiment requirement.Through experiment on IGBT modules of different void ratios,the relationship between void ratio and temperature distribution characteristics was studied.Results proved that the temperature distribution characteristics of IGBT module can be used for quantitative detect of voids,besides,a method on performance evaluation of IGBT modules is given

关 键 词：IGBT模块 温度分布 检测系统 评估 

分 类 号：TN32[电子电信—物理电子学]