Ni对SAC0307无铅钎料性能和界面的影响研究  

Effect of Ni addition on bulk properties and interfacial reaction of SAC0307 solder

作　　者：刘平 钟海锋 龙郑易 顾小龙 

机构地区：[1]浙江亚通焊材有限公司,杭州市310030 [2]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,杭州市310011

出　　处：《焊接》2014年第5期27-30,74,共4页Welding & Joining

基　　金：浙江省科技计划项目(2012F10025)

摘　　要：研究了不同Ni元素含量对SAC0307无铅钎料的力学性能、润湿性能和显微组织,并分析了Ni元素对钎焊接头界面金属间化合物形貌、成分和稳定性,总结了Ni元素在钎料中的作用机理。结果表明,微量Ni元素起到细化组织和改善润湿性的作用,当Ni含量大于0.1%时,焊点界面生成了疏松状的IMC层,且IMC层生长较快,适量的Ni元素改变界面IMC的晶体结构,抑制了界面Cu_3 Sn的生长。The mechanical properties,wetting ability and microstructure of SAC0307-xNi were studied as a function of Ni addition content.The IMC morphology and interfacial stability were also investigated at the interface of soldered joint.The effect mechanism of Ni in the SAC0307 solder was finally analyzed.The result indicated that the small amount of Ni refines the bulk solder microstructure and improves wettablity.When Ni content is more than 0.1%,IMC layer becomes loose at the interface of solder and substrate and IMC grows faster than that of without Ni addition.Proper Ni additions can suppress IMC growth as a result of Ni element substituted Cu atom in Cu_3Sn IMC.

关 键 词：无铅钎料 Ni元素 界面 金属间化合物 

分 类 号：TG425.1[金属学及工艺—焊接]